Solderability Testing  • Standard component testing per IPC/EIA/JEDEC J-STD-002B Test A, Dip & Look – Leaded •Test B, Dip & Look – Leadless •Test C, Wire Wrap Test – Wire •Test S, SMT Devices Custom testing per IPC spec or customer-specified methods  Test documentation supplied, additional customer reports as required PCA and Component Packaging/Repackaging •Component/ PWB Baking •Material Re-bagging Operations ESD & Moisture Barrier compliance