Surface Mount Assembly Capabilities 2 sided SMT reflow; 18"X20" PCB CapabilityProcesses established for handling the following: .4mm, .5mm, .65mm QFP, TQFP, TSOP, TSSOP .8 1.5mm CSP/BGA, DRS-24 system production capability of down to 0402 miniature discretes   Assembly equipment Fuji GP-551 Stencil Printer Fuji FCP65 chipshooter, 18" wide PCB capability Fuji FIP3 fine-pitch placer ERSA Reflow Oven   Rework equipment Pace hot gas rework machines DRS-24 BGA rework machine.