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Surface Mount Assembly
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Surface Mount Assembly


Surface Mount Equipment

  • 2 sided SMT reflow;
  • 18"X20" PCB CapabilityProcesses established for handling the following:
    • .4mm, .5mm, .65mm QFP, TQFP, TSOP, TSSOP
    • .8 1.5mm CSP/BGA, DRS-24 system
    • production capability of down to 0402 miniature discretes


Assembly equipment

  • Fuji GP-551 Stencil Printer
  • Fuji FCP65 chipshooter, 18" wide PCB capability
  • Fuji FIP3 fine-pitch placer
  • ERSA Reflow Oven


Rework equipment

  • Pace hot gas rework machines
  • DRS-24 BGA rework machine.


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